| 刊名 | Asian Agricultural Research |
| 作者 | Xuechao HAN, Yijue GAO, Zhijun ZHANG |
| 作者单位 | Department of Communication Engineering, School of Mechanical Engineering and Rail Transit, Changzhou University; Jiangsu Sino French Water Co., Ltd. Sewage Treatment Branch; Department of Architectural and Environmental Engineering, Huaide College, Changzhou University |
| DOI | 10.19601/j.cnki.issn1943-9903.2025.05.011 |
| 年份 | 2025 |
| 刊期 | 5 |
| 页码 | 55-61 |
| 关键词 | Printed circuit board (PCB) etching wastewater, Micro-electrolysis (ME), Fenton oxidation, Strengthened ME, Fillings passivation |
| 摘要 | Printed circuit board (PCB) etching wastewater is a type of industrial wastewater characterized by its high concentration and challenging treatment processes. The primary pollutants present in the water include ethylic acid, polyethylene, and copper ions (Cu2+). A ferric-carbon micro-electrolysis (ME) process is usually employed to treat the PCB etcheting wastewater. Since the ME process produces iron ions (Fe2+) dispersed in the solution, Fenton oxidation can be performed after ME by simply adding hydrogen peroxide. This study conducted experiments to determine the optimal process parameters for both ME and Fenton oxidation. The total removal efficiencies for chemical oxygen demand (COD) and Cu2+ were 66.34% and 99.71%, respectively. To enhance COD degradation efficiency, various strengthened ME methods were investigated, including ultrasonic Fe-C ME, MnO2 catalytic Fe-C ME, and Fe-Al-C ternary ME. The COD removal efficiencies were increased to 78.3%, 76.5%, and 82%, respectively. Among these methods, Fe-Al-C ME proved to be the simplest and most effective approach for enhancing COD removal. Additionally, the reaction kinetics of Fe-Al-C ME were analyzed. Furthermore, the passivation of ME fillings was examined, as it is the most common factor affecting the stability of the ME process. |
